qu'Intel annonce l'abandon de Larrabee en tant que carte graphique destinée au marché grand public. Attention toutefois, Intel ne jette pas totalement l'éponge. Le groupe indique que la première génération de puce Larrabee servira de plate-forme de test et de développement, préparant ainsi la voie à la seconde génération que l'on espère retrouver sur des cartes graphiques.

Intel Corp. said on Tuesday that it had begun sampling of its code-named Sandy Bridge processors with customers in Q1 2010, about a year ahead of the actual commercial product launch. In addition, the company indicated that its 32nm fabrication process technology is the fastest manufacturing process ever.
Thousands of Sandy Bridge Processors Shipping Now
 
“We began volume sampling [of Sandy Bridge processors] in Q1, shipping thousands of samples to a broad range of customers and we are planning [to begin] volume production later this year,” said Paul Otellini, chief executive officer and president of Intel.
 
The first Intel Sandy Bridge chips will feature two or four cores with Turbo Boost and Hyper-Threading technology as well as integrated graphics processor that will actually be on the same die as the x86 cores, according to previous reports. The chips will address mainstream market segments currently served by Intel Core i7, Core i5 and Core i3 processors, hence, there will be a lot of different models with 65W (dual-core, quad-core) or 95W (quad-core) thermal design power, according to documents seen by X-bit labs. The new processors will use LGA1155 form-factor and will be compatible with platforms based on the Intel 6-series chipsets code-named Cougar Point. It is noteworthy that while the new 6-series mainstream chipsets support Serial ATA-600 and some other innovations, the USB 3.0 does not seem to be a capability of the core-logic.
 
The key feature of Sandy Bridge Intel AVX (Advanced Vector Extensions) which, when used by software programmers, will increase performance in floating point, media, and processor intensive software, according to the Intel. Key features of Intel AVX include wider vectors, increasing from 128 bit to 256 bit wide, resulting in up to 2x peak FLOPs output; enhanced data rearrangement, resulting in allowing data to be pulled more efficiently, and three operand, non-destructive syntax for a range of benefits. Intel AVX can also increase energy efficiency beyond the increases brought by the micro-architectural innovations, and is backwards compatible to existing Intel processors.
 
Some reports claim that six-core and eight-core Sandy Bridge-based designs will become available in Q2 2011 or later, hence, Intel is taking the same strategy as with Westmere micro-architecture and plans to initiate production of less complex processors first with higher-end models following later. The SNB processors will be made using proven 32nm fabrication process, which means that production ramp of the chips may be extremely quick.
32nm – Fastest Ramping Process Technology for Intel
 
While many other companies are struggling with 45nm/40nm process technologies and even cancel 32nm fabrication processes, thanks to new materials that Intel uses to manufacturing its chips using 32nm process technology, the company claims that the 32nm production ramp is the fastest in its history.
 
“In our manufacturing environment our factory teams have executed the ramp of our 32nm process superbly. We exceeded output expectations with lower costs than originally anticipated and are currently shipping over fifty SKUs on 32nm process. 32nm is our fastest ramping process ever and I am pleased to note we are accelerating the ramp of our third and fourth 32nm factories faster than our original plan, such that by early Q4 we will have four factories in production on 32nm,” said Mr. Otellini.
 
According to Stacy Smith, chief financial officer of the world’s largest chipmaker, in the first quarter Intel ended up shipping more 32nm microprocessors than it first planned, which is the result of resurrection of demand towards personal computers.
 
Intel on Tuesday reported first-quarter revenue of $10.3 billion and operating income of $3.4 billion, net income of $2.4 billion and earning per share of 43 cents.

Here’s a quick bit of overheard info for you – Intel’s replacement for its current high-end Core i7 CPU range will arrive in Q3 2011, so if you’re planning an LGA1366 upgrade now (perhaps with a Core-i7 930) then it’s still got plenty of life left in it.
 
The bad news is, there will be no compatibility between current LGA1366 Core i7s and the new socket. Intel is planning on launching a new socket for every new major CPU revision as it’s continuing to incorporate more and more features into future CPUs, which means pin-counts and sockets will inevitably change.
 
Our sources in Taiwan also told us that the new chipset that will accompany this socket - inevitably being called "X68", although this is far from being an official name - will feature four DDR3 DIMM channels. It will only support one DIMM per channel as this maximises memory bandwidth, but memory density will be overall lower than current LGA1366, Core i7 systems as there will only be four sockets versus the six you see on current X58 boards. The chipset will include more PCI-E lanes of some description, either 2.0 or 3.0.
 
No details on the socket pin-count or size are available yet, however we do know the first CPUs will be a native eight-core, 16-thread design (as seen in the just launched Xeon X7650), based on the upcoming Sandy Bridge architecture.
 
The good news is for those who upgraded to LGA1366 in late 2008 or even last year have had a fantastic investment of their money as we expect their systems will continue to be the fastest products available until the replacement late next year.

Nous vous en parlions il y a peu : le processeur Sandy Bridge remplaçant le Core i7 980X dans le haut de la gamme Intel n'est pas prévu avant la fin 2011. Ces caractéristiques sont donc encore loin d'être fixées, mais notre confrère VR-Zone nous révèle quelques informations — à prendre avec des pincettes bien sûr.
 
La première concerne le socket que ce processeur utilisera. Adieu LGA 1366, bonjour LGA 2011. Oui, 2011, comme l'année de ... lire la suite

VR-Zone a pu obtenir quelques informations sur les prochaines plates-formes Intel destinées à la génération Sandy Bridge prévu pour fin 2010 / début 2011. Des informations à prendre avec des pincettes mais qui semblent toutefois crédibles. Intel continuerait ainsi d’avoir deux plates-formes distinctes comme c’est le cas avec le LGA1156 d’une part et le LGA1366 d’autre part.
 
Côté milieu de gamme, le LGA1156 laissera place au LGA1155. Destiné à accueillir des versions 2 et 4 core du futur Sandy Bridge, ce Socket sera supporté par les chipsets P67 et H67, qui remplaceront les actuels P55 et H67. Le P67 ne supportera par l’IGP intégré au Sandy Bridge mais permettra d’utiliser son contrôleur PCI-Express en 1x16 ou 2x8 pour les configurations SLI/CrossFire, alors que le H67 permettra de gérer l’IGP mais sera limité au 1x16. En termes de fonctionnalités, le SATA 6 Gbits/s sera disponible sur 2 des 6 SATA gérés par le chipset, mais l’USB 3 n’est malheureusement pas à l’ordre du jour. Le PCI ne sera plus intégré à ces chipsets.
 
Côté haut de gamme, on retrouve une plate-forme LGA2011 (!) destinée à accueillir les Sandy Bridge-E. Ces processeurs existeraient à priori en version 4 et 6 core, et le cache serait de 15 Mo dans cette dernière version (12 Mo de L3 et 6x512 Ko de L2, contre 6x256 Ko actuellement). Côté mémoire, la DDR3-1600 serait gérée sur 4 canaux, ce qui explique en partie l’augmentation du nombre de points de contacts. Côté PCI-Express, on retrouverait sur cette plate-forme 40 lignes PCI-Express 3.0, contre 36 lignes 2.0 sur la plate-forme X58.
 
Gros changement, le PCI-Express ne serait plus géré par le chipset mais directement par le CPU, comme c’est déjà le cas sur LGA1156. Cette intégration complète du northbridge sonne le glas de l’IOH et du QPI, et on retrouvera donc uniquement un PCH relié au Sandy Bridge-E via un bus DMI à 2 Go /s et un bus PCI-E 3.0 x4 à 4 Go /s. Ce nouveau PCH ne supportera par contre toujours pas l’USB 3, mais il gérera 6 SATA en AHCI dont 2 en SATA 6 Gbits /s, ainsi que 8 autres ports en SATA3/SAS.

We have reported previously that Sandy Bridge, the next generation 32nm hybrid-monolithic CPU/GPU processor supports Intel's LGA 1155 socket. Today, however, we are able to confirm that this socket is slightly different than LGA 1156 Socket H1. In perspective, Socket LGA1156, or H1, is the socket of choice for all Core 2010 processors - Lynnfield, Clarkdale and second-generation Nehalem.
 
 
Intel's new socket, in contrast, is designed specifically for Sandy Bridge CPUs and it is simply called H2. In its future plans, Intel sees this socket as a separate entity from LGA 1156 socket H1. The new socket H2 is also mentioned as LGA 1155, and the apparent absence of a single pin might make all the difference.
 
Due in part to the fact that Sandy Bridge processors require a new 6-series chipset, socket H1 and H2 won't be compatible with each other and in good old Intel's transition philosophy, you will need to swap out and upgrade your motherboard in order to make your new 32nm desktop CPU work.
 
Intel's LGA 1155 H2 socket is expected to take a whopping 9-percent of total socket transition guide in Q1 2011 and it will only grow from that point.

Intel's next generation 32nm design, also known as Sandy Bridge, will enable low power CPUs with as little as 35W Thermal Design Power (TDP).
 
The lower TDP matters for notebooks and some quad-cores already have 65W TDP.  It's also important in the server market, as these guys wants to save as much as they can on their electricity bill.
 
Intel’s 65W quad-cores with the Yorkfield generation are out for a while and with the introduction of Nehalem architecture the power consumption went up and the most power aware Core i5 750S clocked to 2.4GHz has 82W TDP. That is Lynnfield quad-core who also have eight thread support.
 
We can only assume that Intel is talking about the quad-core CPUs and Sandy Bridge also enables 45W TDP designs that now include the graphics as well. It’s a monolithic core, the graphics and the CPU are power entity with the same TDP.
 
Some people really care about the TDP and want to have cool and quiet machine all the time. Let’s not forget the notebook and all-in-one market that will certainly benefit from such a low TDPs, as of Q1 2011.

Les premières photos d'un processeur Intel Sandy Bridge et de son socket sont apparues sur la toile. Elles nous sont apportées par le membre JC du forum XtremeSystems, coutumier de ce genre d'exclusivité.
 

 

 

 

 
On y voit donc un prototype double coeur tournant à 2,4 GHz, doté de 256 ko de cache L2 par coeur et d'un cache L3 partagé de 3 Mo. Ces chiffres coïncident avec les informations connues jusqu'à présent sur Sandy Bridge. On découvre également le nouveau socket LGA 1155, aussi baptisé H2. Au delà du nombre de contacts différent, ce socket se distingue par la position des détrompeurs, qui assurera qu'un CPU 1155 ne pourra pas être monté sur un socket 1156 (voir le schéma ci dessous, publié par Bit-Tech.net).

Core i7 performance at 70W All in One
 
The latest info we revealed about upcoming Sandy Bridge desktop platform promises to take the TDP significantly down, retaining identical performance in the process.
 
Intel divides the market to few segments and one of the important ones is lifestyle desktop platform. The best of this platform, which unites the small form factor cases and all-in-one PCs, is powered by Core i7 and 5 series of chipsets. Intel tells its partners that these systems can operate at 88W TDP.
 
The plan is to replace them with Sandy Bridge CPUs and 6 series chipsets in 1H of 2011. The best part is that this platform should have Core i7 performance if not even higher at 70W TDP. This is some 25 percent better, which sounds like a quite big leap.
 
Still we are missing quite a lot of details as we don’t know much about clocks or performance.  

LGA 1155:  1 DMI , 2 canaux DDR3
 
LGA 1356: 1 QPI, 3 canaux DDR3
 
LGA 2011: 2 QPI, 4 canaux DDR3
 
LGA 2xxx : 4 QPI, 4 canaux DDR3  (??)